Design software
03 August, 2006 | Supplied by: http://www.altium.com.au
Altium has released Designer 6.3 targeted at accelerating the design process. It includes upgraded translation capabilities for migration to Designer from other systems such as OrCAD and PADS.
Paint-on semiconductor outperforms chips
24 July, 2006
Researchers at the University of Toronto have created a semiconductor device that claims to outperform conventional chips – and they made it by painting a liquid onto a piece of glass.
IGBT or MOSFET: choose wisely
05 July, 2006 by Carl Blake & Chris Bull, International Rectifier | Supplied by: International Rectifier
With the proliferation of choices between MOSFETs and IGBTs, it is becoming increasingly difficult for today's designer to select the best device for an application. Here are a few basic guidelines that will help this decision-making process
Graphite may write the future for nano devices
05 June, 2006
Graphite could be the basis for a new class of nanometre-scale electronic devices that have the properties of carbon nanotubes - but could be produced using established microelectronics manufacturing techniques
Port failover software
01 June, 2006 | Supplied by: http://www.metromatics.com.au/
SBS Technologies has announced VD-FOE ethernet port failover software for the VxWorks real-time operating system.
Companies collaborate to grow industry adoption of configurable processor technology
22 May, 2006
ARC International and Toshiba Corporation have announced that they have entered into a strategic collaboration that is intended to increase the worldwide semiconductor industry's adoption of configurable technology.
Paint-on laser to rescue computer chip industry
18 April, 2006
Researchers at the University of Toronto have created a laser that could help save the $200-billion dollar computer chip industry from a looming crisis dubbed the ‘interconnect bottleneck’.
Studying the thin membranes of semiconductors
11 April, 2006
University of Wisconsin-Madison researchers in the US have demonstrated a way to release thin membranes of semiconductors from a substrate and transfer them to new surfaces -an advance that could unite the properties of silicon and many other materials, including diamond, metal and even plastic.
Race to be leading chipmaker in developing markets
04 April, 2006
The heat is on chipmakers Intel and AMD to see who can make the biggest break into emerging markets across the global.
Twin processor package
03 April, 2006 | Supplied by: Intel Australia Pty Ltd
Intel has showcased the Centrino Duo mobile technology for a new generation of laptops.
Jostling for position in Chinese semi industry
31 March, 2006
STMicroelectronics, a European semiconductor manufacturer, has reinforced its intention to strengthen its presence China.
Developing solutions for handset producers
24 March, 2006
Manufacturer of radio solutions and precision analog semiconductors, Skyworks Solutions has announced it is leveraging a bipolar field effect transistor (BiFET) process technology for its gallium arsenide (GaAs)-based products, enabling it to develop solutions for handset manufacturers.
Semiconductor sales hit peak
23 March, 2006
Worldwide sales of semiconductors of $19.66 billion in January were 7 percent higher than January of 2005 when global sales were $18.38 billion, the Semiconductor Industry Association (SIA) of America reported recently.
Philips and Sunext combine on semi technology
16 March, 2006
Philips Electronics and Sunext Technology have completed transfer of Philips Optical Disc Drive (ODD) semiconductor technology and licensing to Sunext.
Intel reaches nanometer milestone
08 March, 2006
Intel announced a milestone in the development of 45 nanometer (nm) logic technology. Intel has produced what are believed to be the first fully functional SRAM (Static Random Access Memory) chips using 45nm process technology, its next– generation, high–volume semiconductor manufacturing process.
