Assembly > Research

Quantum heat engine advances scalable computing

15 July, 2026 by Aalto University

A new quantum heat engine based on superconducting circuits could support larger quantum computers through improved thermal control and hardware integration.


Underground cooling for AI data centres

02 July, 2026 by Lois Yoksoulian, University of Illinois Urbana-Champaign

Underground thermal energy storage could help cool AI data centres while cutting water use and easing the environmental impact of expanding AI infrastructure.


Plastic waste yields battery-grade graphite

02 July, 2026

A novel technique converts PET plastic waste into battery-grade graphite, helping reduce landfill waste while supplying a key material for lithium-ion batteries.


Novel surface treatment protects next-gen computer chips

18 June, 2026

A new coating technique helps prevent damage during chip fabrication, offering a more reliable path to manufacturing future computer chips.


An ultrafast laser on a chip

11 June, 2026 by Nik Papageorgiou, EPFL

A new photonic chip from EPFL delivers high-energy femtosecond laser pulses, paving the way for compact optical clocks, sensing and diagnostics.


Rethinking AI hardware with tiny vibrating silicon beams

11 June, 2026

Researchers have developed a vibrating-beam device that combines memory and computing, offering a new approach to faster, more energy-efficient AI hardware.


New method enhances quantum error detection accuracy

10 June, 2026 by University of New South Wales

UNSW engineers have developed an adaptive quantum measurement method that reduces readout errors, improving fidelity and supporting quantum error correction.


A new approach to nanoscale heat transfer

03 June, 2026 by Kaitlyn Landram, Carnegie Mellon University College of Engineering

Engineers have demonstrated a new way to boost heat transfer at the nanoscale, a development that could reshape electronics cooling and advanced sensing technologies.


Improving current flow in ultra-thin semiconductors

03 June, 2026

Researchers have improved electrical transport in ultra-thin semiconductor devices, offering new insights into the limits of miniaturisation.


Monash team demonstrates room-temperature photonic circuit

27 May, 2026

A Monash-led study has demonstrated a compact photonic circuit that processes multiple streams of light-based information simultaneously.


Moiré ferroelectric pixels enable next-gen nanoelectronics

04 May, 2026

Researchers have demonstrated moiré ferroelectricity in layered nanomaterials, enabling pixel-scale control for next-generation nanoelectronic devices.


Novel technique for tuning superconductivity levels

21 April, 2026 by Tatyana Woodall, Ohio State University

Researchers have developed a technique to tune superconductivity by adjusting a material's environment, enabling control of performance without altering its composition.


Adaptive chip design boosts efficiency in electronics

07 April, 2026 by Michelle Cometa, Rochester Institute of Technology

A new adaptive chip design reduces power use by adjusting performance in real time, boosting efficiency for phones, laptops and other devices.


Brain-inspired AI hardware advances neuromorphic systems

01 April, 2026 by Lindsey Macdonald, Purdue University

Autonomous devices can operate more smartly and efficiently thanks to neuromorphic hardware that mimics the brain's way of combining memory and computation.


Brain-inspired chip material cuts AI energy demands

26 March, 2026

A novel chip material inspired by the human brain could lower AI energy use by mimicking neural processing, opening new possibilities for high-performance computing.


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