Designers of high-density electronics systems can now match 0.15 mm co-planarity connectors with 0.10 mm-thick solder stencils through careful aperture design.
Effective process control is helpful in finding out any issue that may stop assembly manufacturing from smoothly running and minimising the failure rate of products.
This video provides instructions for the mixing of epoxy resins.
The VERSAFLOW 4XL selective soldering system, from Kurtz Ersa, provides good flexibility and application variety with a high level of soldering quality.
Together, Ersa's i-CON 1V and 2V control units are able to drive eight different soldering tools.
The Nordson SELECT range of selective soldering systems caters for different requirements from low to high volume.
ECOREL FREE 305-16LVD is a no-clean, lead-free solder paste developed with the chemistry of the ECOREL solder paste range. The product is suitable for standard convection reflow and vapour phase soldering.
Interflux Electronics' LMPA-Q range of low melting point alloys (LMPAs) is designed to allow users to use soldering temperatures that are lower than for traditional lead-free Sn(Ag)Cu (SAC) alloys.
The DFA VP-Jumbo soldering solution has been specifically designed for reflow soldering in laboratory and prototype environments.
Altronic Distributors has introduced the T 2460A high-power, temperature-controlled soldering station with touch screen. The soldering station incorporates a special intelligent microchip control design.
Metcal soldering stations feature SmartHeat technology, which senses thermal load and instantly delivers power on demand directly to the joint.
Technology company Lenovo has announced a new low-temperature solder (LTS) process, developed to improve PC manufacturing by conserving energy and increasing reliability.
Thermaltronics' soldering irons, based on Curie Heat Technology (CHT), respond to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. In addition, the soldering hand-piece instantly heats and cools upon removing and replacing from its holder.
In the MultiVacuum process, PCBs are subjected to several vacuum applications during the soldering stages, with the option of applying vacuum both before and during the melting of the solder paste.
The use of aluminium paste in photovoltaic and electronics applications is set to boost the aluminium powder, flakes and paste market to 332,000 metric tons in shipments by 2019, according to a new research study from Technavio.