Adelaide-based Tyronics and Tekelek have merged combining their design and manufacturing operations.
This year's Engineering & Machinery Exhibition (EMEX 2004) trade show is running from 11 to 13 May at the Auckland Showgrounds.
Cabac, an Australian-owned company with headquarters in Sydney, has recently celebrated 21 years of meeting the needs of the electrical installation industry.
Tekelek has launched a new services division to provide design and manufacturing support to industry in the United States.
Trio Electrix has been appointed distributor for the Yokogawa test and measurement division in South Australia, Queensland and the Northern Territory.
AEEMA has signed a Memorandum of Cooperation with ICAKorea, Korea's principal ICT agency, on August 14 in Seoul, South Korea.
International Rectifier and Sanyo Semiconductor have announced that they are forming a joint venture to design, develop and market electronic motor drive power modules for energy-efficient appliances and light industrial applications.
The first International Conference on Computational Methods in Fluid Power Technology, will be held in Melbourne, from November 26-28.
South Australian-based valve and pipe fittings specialist Philmac has appointed David Stretton as National Distribution and Logistics Manager and to the company's executive board. Mr Stretton will be responsible for national distribution inventory, purchasing and supply chain management of all finished goods.
The Australian Electrical and Electronic Manufacturers Association (AEEMA) has welcomed the establishment of a new national agency, the National Measurement Institute, to provide measurement standards and services.
Electronic wastes - discarded computers, televisions, mobile phones, audio equipment and batteries - can leach lead and other substances that may seep into groundwater supplies.
The Austronics, Automate, Electrix awards were presented at a gala function compered by John Blackman in the Auditorium at the Melbourne Exhibition Centre on Tuesday 15th October 2002. The winners are listed below.
A new chip for mobile devices which was developed by Bell Labs team in Australia, implements multiple input/output wireless technology, called BLAST (Bell Labs Layered Space-Time). The technology is used in base station equipment and mobile devices, and is claimed to increase the capacity and coverage of wireless networks, and permit higher speed mobile data connections for notebook PCs and hand held devices.
Agere Systems and Infineon Technologies are to jointly develop high-performance chips based on the 802.11 standard. The technology resulting in next-generation wireless LAN products will provide business and residential users with flexible access to email and the Internet. It has a bandwidth that is 20 times higher than current wireless networks and will reach up to 54 Mbit/s.