Radiatation-resistant spintronic material
18 February, 2015Researchers at the University of Michigan and Western Michigan University are exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.
Parallelising common algorithms
02 February, 2015 by Larry HardestyHardware manufacturers are making computer chips faster by giving them more cores, or processing units.
Engineers build a 'high-rise' chip
17 December, 2014Stanford engineers have created a four-layer prototype high-rise chip. In this representation, the bottom and top layers are logic transistors. Sandwiched between them are two layers of memory.
Toshiba TC358870XBG 4K HDMI to MIP dual-DSI converter chipset
01 September, 2014Toshiba has launched the TC358870XBG, a 4K HDMI to MIPI dual-DSI converter chipset with video format conversion. The IC drives up to 4K Ultra HD (3840 x 2160 pixels) at a refresh rate of 30 fps with dual-DSI interface.
Alta Data PCI-A429 ARINC PCI Interface Card
05 February, 2014Alta Data Technologies' PCI-A429 interface module offers a variety of ARINC-419/429/575/573/717 channel configurations with software-selectable RX/Tx channels, baud rates, bit encoding and word configurations (start/sync/stop length, parity, bits/word, MSB/LSB). The product can rncode or decode almost any ARINC-429 physical layer signal.
Computing power made of carbon?
20 September, 2013Scientists at the Vienna University of Technology have now managed to combine a graphene photodetector with a standard silicon chip. It can transform light of all important frequencies used in telecommunications into electrical signals.
Miniature microelectronics for automotive and communications industries
23 August, 2013Infineon Technologies, together with its 40 research partners, has completed a research project for further miniaturisation of microelectronic systems in automobiles, industrial and communications electronics.
u-blox and Intel HSPA modules
12 August, 2013u-blox is collaborating with Intel Corporation to bring a small, cost-effective 3G-only HSPA module to the market. Based on Intel’s XMM 6255 HSPA modem platform, the chipset will be packaged in a compact, low-cost module that maintains layout compatibility with u-blox’s SARA 2G and LISA 3G module series.
Microchips that mimic the brain
29 July, 2013Neuroinformatics researchers from the University of Zurich and ETH Zurich together with colleagues from the EU and US demonstrate how complex cognitive abilities can be incorporated into electronic systems made with so-called neuromorphic chips - they show how to assemble and configure these electronic systems to function in a way similar to an actual brain.
Electronic components made from single molecules
21 June, 2013Now, for the first time, a transistor made from just one molecular monolayer has been made to work where it really counts. On a computer chip.
Using graphene to create computer chips
21 June, 2013A new system, proposed by MIT researchers, uses two-dimensional structures to guide plasmonic waves at ultrashort wavelength, offering a new platform for memory and computer chips.
Korean researchers develop a low-power 60 GHz RF chip for mobile devices
15 April, 2013As the capacity of handheld devices increases to accommodate a greater number of functions, these devices have more memory, larger display screens and the ability to play higher definition video files.
Redesigned material could lead to lighter, faster electronics
12 April, 2013Chemists at The Ohio State University have developed the technology for making a one-atom-thick sheet of germanium and found that it conducts electrons more than 10 times faster than silicon and five times faster than conventional germanium.
Development kit for Cypress’s PSoC 4 architecture now available for pre-order
11 April, 2013Premier Farnell and Cypress Semiconductor Corp have announced that customers can now pre-order the PSoC 4 Pioneer Development Kit from element14.
Improving chip-cooling technology
05 April, 2013Researchers from the Georgia Institute of Technology have won a Defense Advanced Research Projects Agency (DARPA) contract to develop 3D chip cooling technology able to handle heat loads as much as 10 times greater than systems commonly used today.
