Components > Chipsets

Designer crystals for more powerful electronics

15 December, 2015

A new process to grow designer crystals, known as 'metal organic frameworks' or MOFs, could lead to a new breed of faster, more powerful electronic devices.


Dialog Semiconductor iW630+iW1780+iW671 Rapid Charge adapter chipset

04 August, 2015

Dialog Semiconductor has released its iW630+iW1780+iW671 Rapid Charge adapter chipset. The chipset provides the high efficiency and power density needed for small-form-factor, fast-charging smartphones and mobile device power adapters.


Faster multicore chips

23 February, 2015 by Larry Hardesty, MIT News Office

Computer chips' clocks have stopped getting faster. To keep delivering performance improvements, chipmakers are instead giving chips more processing units, or cores, which can execute computations in parallel.


Radiatation-resistant spintronic material

18 February, 2015

Researchers at the University of Michigan and Western Michigan University are exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.


Parallelising common algorithms

02 February, 2015 by Larry Hardesty

Hardware manufacturers are making computer chips faster by giving them more cores, or processing units.


Engineers build a 'high-rise' chip

17 December, 2014

Stanford engineers have created a four-layer prototype high-rise chip. In this representation, the bottom and top layers are logic transistors. Sandwiched between them are two layers of memory.


Toshiba TC358870XBG 4K HDMI to MIP dual-DSI converter chipset

01 September, 2014

Toshiba has launched the TC358870XBG, a 4K HDMI to MIPI dual-DSI converter chipset with video format conversion. The IC drives up to 4K Ultra HD (3840 x 2160 pixels) at a refresh rate of 30 fps with dual-DSI interface.


Alta Data PCI-A429 ARINC PCI Interface Card

05 February, 2014

Alta Data Technologies' PCI-A429 interface module offers a variety of ARINC-419/429/575/573/717 channel configurations with software-selectable RX/Tx channels, baud rates, bit encoding and word configurations (start/sync/stop length, parity, bits/word, MSB/LSB). The product can rncode or decode almost any ARINC-429 physical layer signal.


Computing power made of carbon?

20 September, 2013

Scientists at the Vienna University of Technology have now managed to combine a graphene photodetector with a standard silicon chip. It can transform light of all important frequencies used in telecommunications into electrical signals.


Miniature microelectronics for automotive and communications industries

23 August, 2013

Infineon Technologies, together with its 40 research partners, has completed a research project for further miniaturisation of microelectronic systems in automobiles, industrial and communications electronics.


u-blox and Intel HSPA modules

12 August, 2013

u-blox is collaborating with Intel Corporation to bring a small, cost-effective 3G-only HSPA module to the market. Based on Intel’s XMM 6255 HSPA modem platform, the chipset will be packaged in a compact, low-cost module that maintains layout compatibility with u-blox’s SARA 2G and LISA 3G module series.


Microchips that mimic the brain

29 July, 2013

Neuroinformatics researchers from the University of Zurich and ETH Zurich together with colleagues from the EU and US demonstrate how complex cognitive abilities can be incorporated into electronic systems made with so-called neuromorphic chips - they show how to assemble and configure these electronic systems to function in a way similar to an actual brain.


Using graphene to create computer chips

21 June, 2013

A new system, proposed by MIT researchers, uses two-dimensional structures to guide plasmonic waves at ultrashort wavelength, offering a new platform for memory and computer chips.


Electronic components made from single molecules

21 June, 2013

Now, for the first time, a transistor made from just one molecular monolayer has been made to work where it really counts. On a computer chip.


Korean researchers develop a low-power 60 GHz RF chip for mobile devices

15 April, 2013

As the capacity of handheld devices increases to accommodate a greater number of functions, these devices have more memory, larger display screens and the ability to play higher definition video files.


  • All content Copyright © 2020 Westwick-Farrow Pty Ltd