A new process to grow designer crystals, known as 'metal organic frameworks' or MOFs, could lead to a new breed of faster, more powerful electronic devices.
Dialog Semiconductor has released its iW630+iW1780+iW671 Rapid Charge adapter chipset. The chipset provides the high efficiency and power density needed for small-form-factor, fast-charging smartphones and mobile device power adapters.
Computer chips' clocks have stopped getting faster. To keep delivering performance improvements, chipmakers are instead giving chips more processing units, or cores, which can execute computations in parallel.
Researchers at the University of Michigan and Western Michigan University are exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.
Hardware manufacturers are making computer chips faster by giving them more cores, or processing units.
Stanford engineers have created a four-layer prototype high-rise chip. In this representation, the bottom and top layers are logic transistors. Sandwiched between them are two layers of memory.
Toshiba has launched the TC358870XBG, a 4K HDMI to MIPI dual-DSI converter chipset with video format conversion. The IC drives up to 4K Ultra HD (3840 x 2160 pixels) at a refresh rate of 30 fps with dual-DSI interface.
Alta Data Technologies' PCI-A429 interface module offers a variety of ARINC-419/429/575/573/717 channel configurations with software-selectable RX/Tx channels, baud rates, bit encoding and word configurations (start/sync/stop length, parity, bits/word, MSB/LSB). The product can rncode or decode almost any ARINC-429 physical layer signal.
Scientists at the Vienna University of Technology have now managed to combine a graphene photodetector with a standard silicon chip. It can transform light of all important frequencies used in telecommunications into electrical signals.
Infineon Technologies, together with its 40 research partners, has completed a research project for further miniaturisation of microelectronic systems in automobiles, industrial and communications electronics.
u-blox is collaborating with Intel Corporation to bring a small, cost-effective 3G-only HSPA module to the market. Based on Intel’s XMM 6255 HSPA modem platform, the chipset will be packaged in a compact, low-cost module that maintains layout compatibility with u-blox’s SARA 2G and LISA 3G module series.
Neuroinformatics researchers from the University of Zurich and ETH Zurich together with colleagues from the EU and US demonstrate how complex cognitive abilities can be incorporated into electronic systems made with so-called neuromorphic chips - they show how to assemble and configure these electronic systems to function in a way similar to an actual brain.
A new system, proposed by MIT researchers, uses two-dimensional structures to guide plasmonic waves at ultrashort wavelength, offering a new platform for memory and computer chips.
Now, for the first time, a transistor made from just one molecular monolayer has been made to work where it really counts. On a computer chip.
As the capacity of handheld devices increases to accommodate a greater number of functions, these devices have more memory, larger display screens and the ability to play higher definition video files.