Phone chip under joint development
08 December, 2008NTT Docomo, Renesas, Fujitsu and Sharp plan to jointly develop the SH-mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA/HSDPA/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards.
Taiwan chip designers count down trend
26 November, 2008Taiwan, with the world’s second-largest chip design industry, has some companies that have countered a slump in the global economy by tapping emerging markets such as China.
Controller area network (CAN)
10 November, 2008Embedded Logic Solutions supplies a range of controller area network (CAN)-based solutions. Whether the user needs a plug-in card for the PC, a microcontroller module for temperature recording, a CANopen-based application, or just the right kind of cable, the company claims to cover the user's needs.
Phone chip under joint development
10 November, 2008NTT Docomo, Renesas, Fujitsu and Sharp plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA/HSDPA/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards.
Chip scales under scrutiny
02 September, 2008Smaller and faster are two goals in today’s electronics market, and an article in an international trade publication shows how North Dakota State University researchers, Fargo, design and build such electronics packages.
Silicon back in the race for quantum computers
02 September, 2008The odds that the quantum computer will be built of silicon have increased now that researchers from the Centre for Quantum Computer Technology (CQCT) have announced recently invented technology.
Compact cooling results in faster and more sensitive electronics
28 August, 2008Researcher Srinivas Vanapalli has investigated the possibilities for the extreme cooling of electronic components at a chip level.
Voice interface chips
01 August, 2008Zarlink Semiconductor has launched its latest family of voice interface solutions, the VE890 series, optimised for the international digital subscriber line market.
Thermoelectric breakthrough in silicon nanowires
11 February, 2008Energy lost as heat during the production of electricity could be harnessed using synthesised silicon nanowires
Breakthrough in organic RFID
11 February, 2008The Holst Centre presented a plastic 64-bit inductively coupled passive RFID tag operating at 13.56 MHz at the International Solid State Circuit Conference.
Pushing the limits of chip miniaturisation
22 January, 2008Over the last four decades, computer chips have found their way into virtually every electronic device in the world. During that time they have become smaller, cheaper and more powerful
Sandwich technique solution
22 January, 2008Complex three-dimensional (3D) integrated circuits involving both optical and electronic elements are now easier to make, thanks to a 'wafer bonding' technique developed by a European research consortium
Distributor of RFID modules appointed
05 November, 2007Unique Micro Design Pty Ltd (UMD), a distributor of ‘edgeware’ devices and solutions, has been appointed as the Australian and NZ distributor of RFID modules by SkyeTek, a US-based company specialising in low-cost RFID modules for embedded and mobile applications.
Energy-efficient milestone
23 March, 2007Intel Corporation has announced two energy-efficient 50 W server processors that represent a 35 to nearly 60% decrease in power from Intel's existing 80 and 120 W quad-core server products.
Prototyping a secure multi-purpose mobile chip
14 November, 2005A high-capacity chip under development is claimed to have the potential to do away with many of the identity documents, credit cards and passwords people have to use each day. The IST program-funded project SM-PAYSOC has created a working prototype of the chip packaged in a smartcard, which in the future could also be incorporated into a USB token or a SIM card.
