Components

Redfern Polymer Optics launches

25 September, 2001

Redfern Polymer Optics, a developer and manufacturer of polymer planar and fibre components and polymer optical fibers, has just announced its formal launch. The company has raised $7.5 million in seed funding, mainly from Redfern Photonics.


Semiconductor sales now down

20 September, 2001

Worldwide semiconductor sales may decrease 34% in 2001 after terrorist attacks stalled shipments last week and may hurt consumer purchases, market researcher IC Insights, said. This follows last weeks report that sales would increase in 2001.


Monolithic ICs

11 September, 2001 | Supplied by: Soanar Limited

A series of MOS monolithic integrated circuits (MOSMICs) that will allow designers to upgrade the performance of UHF and VHF tuners at no additional cost has been announced by Vishay Intertechnology. Serving as a low-noise RF input stage, the 'X' devices provide improved automatic gain control and cross modulation behaviour compared with previous-generation MOSMICs.


Embedded Computers

11 September, 2001 | Supplied by: Backplane Systems Technology Pty Ltd

Backplane Systems has released its latest Microspace boards, the MSMP3SEN and MSMP3SEV, designed and manufactured by Digital-Logic AG.


Vertical Mount Inductors

11 September, 2001 | Supplied by: Clarke & Severn Electronics

Gowanda Electronics has introduced a series of vertical surface mount toroidal inductors - SMRF 2007 - that optimises board space in RF applications.


Magnetism to increase computer memory

10 September, 2001

Magnetic materials, built up as multi-layered sandwiches with successive layers only a few atoms thick, are giving computers larger memories. By building up sandwiches of magnetic and non-magnetic materials one layer of atoms at a time, it is possible to manipulate, enhance and control the magnetic properties of such sandwiches with extraordinary precision.


Griffith University expands hard drive capacity

06 September, 2001

Computer hard drives look set to hold up to 1000 times more data, thanks to research at Griffith University using nanotechnology, the science of miniature machines.


HP to buy Compaq?

04 September, 2001

Is has been reported that Hewlett-Packard will buy Compaq for an estimated $47.5 billion. Both the New York Times and Wall Street Journal have reported the deal, citing people close to the negotiations, but both companies have declined comment. Compaq Australia said it could not confirm or deny the reports.


Fan Speed Controller

14 August, 2001 | Supplied by: Soanar Limited

Linear Technology has introduced the LTC1840, a dual fan speed controller with a two-wire interface for network servers, desktop PCs or other high efficiency applications where a separate DC-DC converter drives each fan.


Power Supply Chip

14 August, 2001 | Supplied by: Braemac Pty Ltd

Designed to simplify offline power supplies up to 15 W, the L6590 fully integrated power supply chip from STMicroelectronics integrates a 700 V power MOSFET switch, plus all the control circuits needed to build a converter using flyback, boost or forward topologies.


Embedded Control System

10 July, 2001 | Supplied by: Dominion Electronics

Dominion Electronics has announced the Smart Star series - a modular, expandable, embedded control system specifically designed for real-time control and data acquisition.


Barrier Diode

10 July, 2001 | Supplied by: Fairmont Marketing

Rohm has recently developed a Schottky barrier diode (RB063L-30) that has both a low VF (forward voltage) and low IR (reverse current).


RF Reed Relay

10 July, 2001 | Supplied by: C&K Components Plus

Crydom Magnetics has launched a reed relay range with improved RF performance.


Memory card production begins

09 July, 2001

SanDisk and Toshiba America Components state that their FlashVision fabrication (fab)plant has gone into production of advanced flash memories.


Chip speed breakthrough

06 July, 2001

Simplex and Toshiba have announced a semiconductor architecture with the potential to deliver simultaneous improvements of 10+% greater chip performance, 20+% less power consumption and 30+% more chips per wafer.


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