Motorola Labs, partnering with the DigitalDNA Laboratories of the Semiconductor Products Sector, has disclosed an industry milestone in developing MRAM (magnetoresistive random access memory).
In an increasingly mobile world of go-anywhere, do-everything personal products, the semiconductor industry is locked into a search for technologies that support lower power consumption and enhanced reliability in highly integrated LSI.
To develop a strong vertically integrated photonics industry in Australia, maximum cumulative 'value-add' needs to be retained here, according to Angus M Robinson, Executive Director, AEEMA.
Two acquisition modules and two software enhancements have been announced for the TLA Logic Analyser Family. The acquisition modules provide increased memory depth for the TLA700. The software enhancements include a capability that doubles timing speed and standardises the Windows 2000 operating system on both the TLA700 and TLA600.
Toshiba Corporation has announced commercialisation of a 7.7 inch, low-temperature, polysilicon thin film transistor (TFT) liquid crystal display (LCD), designed for mid-size electronic books supporting Microsoft's ClearType technology. Jointly developed by Microsoft and Toshiba the display will enter mass production at the beginning of 2001.
There is an opportunity for Australia to build a strong, wealth-creating photonics industry, but only if start-up photonics companies focus on the requirements of their customers, shareholders and staff, according to Mr Kevin Kalkhoven, recently retired chief executive of JDS Uniphase.
The Australian Photonics Cooperative Research Centre (CRC), in association with the Australian Electrical & Electronic Manufacturers' Association (AEEMA), is holding two forums on Wednesday 8th and Thursday 9th November, at the National Convention Centre in Canberra.
Taking the next step in the evolution of its DSP56800 core, Motorola Inc. today announced the enhanced DSP56800E core family of digital signal processors (DSPs).
Hyundai Electronics and Electronics and Telecommunication Research Institute have announced plans for the joint development of a radio frequency chipset, using the complementary metal oxide semiconductor (CMOS) fabrication process and RF CMOS integrated circuit technology.