OKW IIoT enclosures
01 March, 2022 | Supplied by: ROLEC OKW Australia New Zealand P/LOKW Gehäusesysteme offers suitable enclosure solutions for IIoT applications.
Hammond Electronics 1455 Series extruded enclosures
01 March, 2022 | Supplied by: Hammond Electronics Pty LtdDesigned to house single or multiple PCBs, mounted horizontally into internal slots in the body of the case, Hammond Electronics' 1455 Series enclosures are also suitable for housing any small electronic, electrical or pneumatic systems or components.
Creative Materials 129-32 electrically conductive ink
25 January, 2022 | Supplied by: Creative Materials IncThe material is designed to be flexible for forming and is resistant to washout during the moulding process.
Atom by atom: building a silicon quantum computer chip
17 January, 2022Australian and German researchers have developed a technique for embedding single atoms in a silicon wafer one by one.
DuPont Pyralux HP laminate adhesive system
14 January, 2022 | Supplied by: DuPont Australia Pty LtdTo improve the performance of electronic devices, DuPont developed the epoxy-based Pyralux HP laminate adhesive system, featuring good insertion loss performance, functionality and processing.
Considerations when specifying enclosures for Industry 4.0 applications
13 December, 2021 by Pat Cookson | Supplied by: Hammond Electronics Pty LtdGiven that an enclosure must provide a secure and robust environment, there are several criteria to consider when choosing the product design.
Acromag APCe8775 carrier card
09 December, 2021 | Supplied by: Metromatics Pty LtdAcromag's APCe8775 carrier card provides power, PCIe bus signals and cooling air to an XMC mezzanine module for high-performance signal processing in small embedded computer systems.
Thin and flexible PCBs based on parylene
29 November, 2021Scientists have successfully developed flexible printed circuit boards with an overall thickness of less than 20 µm and several metallisation layers.
EXAIR ½″ Siphon Fed air atomising spray nozzle
25 November, 2021 | Supplied by: Compressed Air Australia Pty LtdEXAIR's ½″ Siphon Fed air atomising spray nozzle atomises a variety of fluids in a round spray pattern where no liquid pressure is available and heavy application of liquid is needed.
Creative Materials 122-47 polyimide adhesive
02 November, 2021 | Supplied by: Creative Materials IncThe product can be applied by stamping, screen printing, dipping and syringe dispensing, and is designed for die-attachment and surface-mount applications.
BOPLA Bocube industrial enclosures
01 November, 2021 | Supplied by: ERNTEC Pty LtdThe enclosures are made of flame-retardant or self-extinguishing materials in ABS or polycarbonate UL 94 V0, with a simple design that contains no metal parts.
DuPont Microcircuit Materials ME102, ME604 and ME614 silver pastes
21 October, 2021 | Supplied by: DuPont Australia Pty LtdDuPont has introduced a suite of silver bearing thick film paste conductors to enable in-mould electronic devices.
Hammond Electronics 1552 series handheld enclosures
01 October, 2021 | Supplied by: Hammond Electronics Pty LtdHammond Electronics has launched its 1552 family of handheld enclosures. Initially available in six sizes, the IP54 rated UL94-V0 flame-retardant ABS enclosure features an ergonomic design that fits comfortably into the hand.
Considerations for designing sheet metal enclosures
01 October, 2021 | Supplied by: ERNTEC Pty LtdCustom-designed sheet metal enclosures can offer a low-cost, fast-time-to-market solution for housing electronics.
Arduino Nano RP2040 Connect development board
30 September, 2021 | Supplied by: element14The Arduino Nano RP2040 Connect provides a development platform for the Raspberry Pi-designed RP2040 microcontroller.
