Vishay Intertechnology has announced the vPolyTan series of surface-mount polymer tantalum moulded chip capacitors in five compact case sizes. Optimised for computer, telecom and industrial applications, Vishay Polytech T55 series devices feature ultralow ESR down to 30 mΩ at +25°C and 100 kHz.
Vishay Intertechnology has enhanced its QUAD HIFREQ series of high-power, surface-mount multilayer ceramic chip capacitors (MLCCs). The devices are designed for high-frequency RF applications in MRI coils and generators, RF instrumentation, telecom base stations, lasers and military communications systems.
TDK Corporation presents the latest series of Epcos snap-in aluminium electrolytic capacitors. They are characterised by a ripple current capability said to be up to 25% higher than that of the preceding Epcos series.
Kemet has released its latest lines of super capacitors, inductors and signal relays, suitable for automotive, communications and industrial applications.
Multilayer organic capacitors (MLOCs), from AVX, are polymer-based capacitors that use high-conductivity copper interconnects in a multilayer fashion.
Cornell Dubilier has announced an expanded line of MLS flatpack aluminium electrolytic capacitors. The additions to the MLS Series include a high-vibration package (HVMLS) and a high-reliability burn-in option (HRMLS).
RS Components has introduced a range of multilayer ceramic capacitors (MLCCs) in 7 or 13″ reel quantities. The devices provide users with general-purpose capacitor parts ready for automatic pick and placement.
The SP-Cap, POSCAP, OS-CON and Polymer Hybrid capacitors from Panasonic provide high efficiency and low ESR alternatives to traditional capacitors. The range benefits from lifetime extension as well as high safety and reliability.
Sprague Goodman Electronics has expanded its non-magnetic variable capacitor product line with the SGNM Series. The product is claimed to be the first high-voltage (up to 12 kV) non-magnetic ceramic dielectric trimmer capacitor line for MRI and NMR applications. It is internally sealed to withstand external pressure of up to 40 psi and has residual magnetic value less than 20 nT.
Researchers have developed a way to shrink capacitors even further, which could accelerate the development of more compact, high-performance next-gen devices.
Researchers have developed a supercapacitor out of silicon so it can be built into a silicon chip along with the microelectronic circuitry that it powers. In fact, it should be possible to construct these power cells out of the excess silicon that exists in the current generation of solar cells, sensors, mobile phones and a variety of other electromechanical devices, providing a considerable cost savings.
Researchers at Ulsan National Institute of Science and Technology (UNIST) have developed a new method to massively synthesise enhanced yet affordable materials for supercapacitors.
Electroactive polymers have been used for some time in actuators, capacitors and nanocomposites but, with new recent technical progress, come new growth opportunities.
A new process for growing forests of manganese dioxide nanorods may lead to the next generation of high-performance capacitors.
Supercapacitors (ultracapacitors) are now centre stage for designers of electronics and particularly power circuits. This is because they are improving faster than the batteries and electrolytic capacitors they increasingly replace. Supercapacitors Europe 2013, forming part of IDTechEx’s premier technology events, is being held in Berlin, Germany, 17 to 18 April.