Archer assembles 'few-qubit array' for quantum chip
02 December, 2019Archer Materials has assembled and patterned a nanometre-size array of several individual qubit material components of a prototype room-temperature operating quantum computing qubit processor.
RECOM RPX2.5 all-in-one integrated power module
01 December, 2019 | Supplied by: RECOM Power GmbHThe RPX-2.5 all-in-one integrated module (buck regulator, inductor and capacitor) features flip-chip technology which increases power density and improves thermal management.
Optical switch can reroute light in computer chips
29 November, 2019The compact switch is claimed to be the first to operate at voltages low enough to be integrated onto low-cost silicon chips, and redirects light with very low signal loss.
Laird Connectivity BL654PA power amplified module
29 November, 2019 | Supplied by: Mouser ElectronicsThe FCC, IC, RCM, KC and Bluetooth SIG-certified module allows engineers to implement single-mode Bluetooth 5 and Thread (802.15.4) technology into simple Bluetooth Low Energy designs.
NXP Semiconductors S32K ISELED-enabled microcontrollers
27 November, 2019 | Supplied by: Mouser ElectronicsNXP Semiconductors has released its S32K ISELED-enabled microcontrollers. ISELED is an open alliance dedicated to providing next-generation smart LED lighting technology specifically geared towards automotive and industrial applications.
Tiny quantum chip enables secure communications
25 November, 2019The quantum communication chip is said to be 1000 times smaller than current quantum set-ups, while offering the same high security that quantum technology is known for.
Würth Elektronik WE-STST Super Tiny Signal Transformers for LAN interfaces
22 November, 2019 | Supplied by: Wurth Electronics Australia PtyWürth Elektronik's WE-STST Super Tiny Signal Transformers for LAN interfaces feature a maximum component height of 2.9 mm and can be used in up to 1000Base-T applications with at least 350 µH inductance.
NXP Semiconductors i.MX 7ULP applications processors
21 November, 2019 | Supplied by: Mouser ElectronicsThe i.MX 7ULP applications processors, from NXP Semiconductors, are based on Arm Cortex-A7 and Cortex-M4 cores with separate isolated domains, and include both 3D and 2D graphics processing units (GPUs).
Shape-changing electronics for wearable applications
20 November, 2019A research team has developed a multifunctional electronic platform that can mechanically transform its shape, flexibility and stretchability.
Dietary fibre purifies carbon nanotubes
15 November, 2019The method could be upscaled for manufacturing purified batches of single-wall carbon nanotubes for use in high-performance electronic devices.
Instabilities found on common semiconductor material
13 November, 2019It turns out that the surface of a commonly used compound semiconductor material — gallium arsenide (GaAs) — is not as stable as previously thought.
Silicon III-V chips could be commercially manufactured
11 November, 2019Researchers have announced a commercially viable way to manufacture integrated Silicon III-V chips with high-performance III-V devices inserted into their design.
Winmate Chassis Mount 4K UHD Military Display
08 November, 2019 | Supplied by: Backplane Systems Technology Pty LtdWinmate's Chassis Mount 4K UHD Military Display is a complete military-grade video wall solution engineered in 27″, 32″ and 40″ sizes and with 4K-UHD/HD options.
Silver nanowires offer transparency
08 November, 2019Researchers have developed a submicrometre-thin mesh of silver nanowires that are transparent to light, highly electrically conductive, flexible, stretchable and simple to make.
Novel data converters can be designed in hours
07 November, 2019Compared to traditional analog architectures and methodologies, the design turnaround time for the novel sensor interfaces is reduced from months to hours.
