Pushing the bounds of superconductivity
08 March, 2013A multiuniversity team of researchers has artificially engineered a unique multilayer material that could lead to breakthroughs in both superconductivity research and in real-world applications.
Microchip BodyCom uses human body as a secure, low-power communication channel
05 March, 2013Microchip Technology has announced its BodyCom technology, which provides designers with a framework for using the human body as a secure communication channel. Compared to existing wireless methods, BodyCom technology provides lower energy consumption, while further increasing security via bidirectional authentication.
RS Components mbed application board
04 March, 2013RS Components has available an mbed application board that supports rapid prototyping.
Highly energy-efficient CMOS logic systems
01 March, 2013Non-volatile bistable memory circuits being developed by Satoshi Sugahara and his team at Tokyo Institute of Technology are paving the way for highly energy-efficient CMOS logic systems.
Transient and vanishing electronics for the battlefield
25 February, 2013A new program aims to develop electronics that simply disappear when they are no longer needed on a battlefield. This will limit the access of enemy forces to the technologies and equipment harvesting.
Nanoscopic microcavities offer control in light filtering
11 February, 2013Using the geometric and material properties of a unique nanostructure, Boston College researchers have uncovered a novel photonic effect where surface plasmons interact with light to form ‘plasmonic halos’ of selectable output colour.
A new material for environmentally friendlier electronics
11 February, 2013A new ferroelectric material has been created by an international team of researchers. With properties analogous to those of a magnet in electricity, this new material has a lower impact on the environment.
ams AS3953 NFiC interface chip
05 February, 2013The ams AS3953 interface chip offers a high data-rate interface between an NFC device such as a smartphone and any host microcontroller with a standard serial peripheral interface (SPI).
NXP Semiconductors NextPower Live power MOSFETs for hot-swap applications
24 January, 2013NXP Semiconductors’ NextPower Live family of linear mode Power MOSFETs is designed specifically for use in hot-swap environments. The family offers both good linear mode performance and a low RDS(on) value.
Emerson Network Power ATCA-7470 40G ATCA blade
14 January, 2013The latest 40G AdvancedTCA (ATCA) packet processing blade from Emerson Network Power - the ATCA-7470 - is designed to utilise the full capabilities of the Intel platform for communications infrastructure, formerly codenamed Crystal Forest, with an optimised balance of processing, memory, I/O, data movement and interfaces.
Microchip Technology MGC3130 e-field-based, configurable 3D gesture controller
10 January, 2013MGC3130 is an e-field-based, configurable 3D gesture controller that includes a library of gestures and is claimed to provide precise hand position tracking.
congatec reference board for video wall system design
10 January, 2013Video wall systems increasingly rely on high-quality videos and (3D) graphics and therefore require a maximum number of graphics interfaces. The congatec reference board offers up to nine independent DisplayPort connectors in combination with an MXM graphics module and a COM Express CPU module.
Extension of operation temperature range to 200°C enabled by Al/Cu wire bonds
19 December, 2012The demand for an extension of the operation temperature range to 200°C has been promoted by several trends.
Boosting heat transfer with nanoglue
13 December, 2012A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. Results of the team’s study could enable new advances in cooling computer chips and lighting-emitting diode (LED) devices, collecting solar power, harvesting waste heat and other applications.
Self-assembled monolayers create p-n junctions in graphene films
11 December, 2012 by John ToonA low-temperature, controllable and stable method has been developed to dope graphene films using self-assembled monolayers (SAM) that modify the interface of graphene and its support substrate. Using this concept, a team of researchers at the Georgia Institute of Technology has created graphene p-n junctions - which are essential to fabricating devices - without damaging the material’s lattice structure or significantly reducing electron/hole mobility.
