Nano-competence for hard thin films
28 January, 2003
Major advances are still being made on magnetic disk drives despite competition from optical storage media like CD-ROM, DVD, semiconductor flash and smart cards.
Photochemically-etched anodes and cathodes for high volume applications
22 January, 2003
Photofabrication Engineering Inc (PEI) has a line of custom-made photochemically-etched anodes and cathodes for fuel cells, heat exchangers, oxygen and hydrogen generators. These products have applications in the aerospace, automotive , biotechnology, medical, appliances, power and electrical/electronic industries.
Research promises faster, cheaper microchips
21 January, 2003
The University of Newcastle upon Tyne, UK has joined forces with Atmel to create 'strained silicon' microchips, which involves adding a material called germanium to the traditional silicon used in semiconductor manufacturing.
Closure of Semiconductor Facility
11 November, 2002
Philips has announced a plan for a phased closure of its semiconductor fabrication operation (fab) in Albuquerque, New Mexico at the end of 2003.
Sales up for semiconductor market
07 November, 2002
It has been reported by the Semiconductor Industry Association (SIA) that global sales of semiconductors are recovering and are forecast to rise 1.8 % to $141 billion in 2002 and about 20% in each of the next 2 years.
Semi-conductor chip for fibre channel SANS
07 November, 2002 | Supplied by: http://www.agilent.com/
Agilent has introduced what is claimed to be the industry's smallest four-port serialiser/deserialiser (SerDes) integrated circuit (IC) designed specifically for fibre channel storage area networking (SAN) equipment used to store and transport data between servers and larger corporate data centres.
Insulating materials for microelectronics
15 October, 2002
Researchers from the Commerce Departments National Institute of Standards and Technology reported they have developed methods for characterising key structural features of porous films being eyed as insulators for the ultrathin metal wires that will connect millions of devices on future microprocessors and increase processor speed.
Revolution in PC Microprocessing
11 October, 2002
Intel are be releasing a PC microprocessor with a new capability developed with the assistance of Dean Tullsen, called hyper-threading. The processor executes instructions from multiple threads/programs at once, as if they all came from a single thread. The CPU duplicates the architectural state on each processor, while sharing one set of processor execution resources. It makes one processor appear as two to the operating system.
Voice controlled electronics
10 October, 2002
Scientist from the Fraunhofer Institute for Computer Graphics Research IGD are working on a voice analysis system and a camera with image processing. They are focussing on designing voice activated electrical appliances and electronic equipment. An example may be a video recorder that is activated by someone saying "Record the news on channel 7 this evening" or a lamp which is turned off by the voice command of "lamp out".
Sealed up with MEMS and IC technologies
02 September, 2002
A wafer scale foundry-based method of hermetically sealing surface sensitive devices such as MEMS and RF has been released by Ziptronix. It operates at room temperature using industry standard tools and materials and incorporating both MEMS and IC technologies.
Organic semiconductors
27 August, 2002
A team of Cornell University researchers is planning to develop a method to connect wires to organic transistors. They are hoping this could lead to computers that are smaller, cheaper and more flexible - literally.
90 nm Semiconductor Manufacturing Process
19 August, 2002
Intel Corporation has made several technology breakthroughs that the company has integrated into its 90-nanometre process. It has used this process to build silicon structures and memory chips. It will put this process into volume manufacturing next year using 300 mm wafers.
Nanotube technology to replace silicon chips
24 May, 2002
IBM scientists have developed a transistor technology that could enable production of a new class of smaller, faster and lower power computer chips than currently possible with silicon.
Low-temperature polysilicon
05 May, 2002
In the active-matrix liquid-crystal displays (AMLCDs)now typically found in laptop computers and an increasing number of monitors, each pixel is driven by an amorphous-silicon transistor that is fabricated directly onto the glass
Design Software
09 April, 2002 | Supplied by: Braemac Pty Ltd
The Quartus II Web Edition software is a design, place-and-route, and verification environment available as a free download from the Altera web site.
