The SKV Series skived fin heat sinks, from Wakefield-Vette, are designed to support the latest trends in renewable energy, industrial electrification and transportation.
How can motor drive costs be optimised? The answer is by improving the power density through reducing the thermal impedance of the power system.
CUI's aluminum heat sinks, available in both extruded and stamped versions, are compatible with TO‑218, TO‑220, TO‑252 and TO‑263 transistor packages.
The EXAIR small 316 stainless steel cabinet cooler systems with electronic temperature control keep electrical enclosures cool with -7°C air, while maintaining the NEMA 4X rating of the enclosure and resisting the heat that could adversely affect the internal components.
US researchers have reported a technique designed to address mobile hotspots, which come about through electronic devices' inability to evenly dissipate the waste heat they produce.
Responding to rising demand for silicone-free thermal paste, Vincotech has approved Müller-Ahlhorn Thermigrease TG 20032 for the company's power modules. MiniSKiiP modules are the first to ship with this pre-applied silicone-free thermal paste.
Zipper fin heat sinks from Advanced Thermal Solutions (ATS) protect components from the dangers of excess heat.
element14 has launched a heatsink for the Raspberry Pi. The product protects the microcomputer from overheating and thus reduces the risk of hardware failure.
The self-contained units are designed to remove a large amount of heat from densely packed electronic environments.
The Laird Technologies Tflex XS400 series is the latest thermal pad in the thermal gap filler range, offering a compliant elastomer filler specifically designed to provide moderate thermal performance with a conductivity of 2.0 W/mK.
The Tflex SF600 DF has been added to Laird Technologies’ Tflex thermal gap filler range. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.
Elma Electronic has released a range of front panels that are also heat sinks. The panels dissipate heat while covering open sections of an enclosure.
Insotec Australia supplies precision machined components produced to exacting quality standards that are used in a wide range of industries, including ticketing, communication, medical, aerospace and industrial equipment.
StockCap has added a range of low-voltage medium-wall heatshrink tubes.
Molex has received approval for its CoolFin heat sink from AMD for the next generation 64 bit processor, the Athlon 64.