Assembly > Heatsinks

Wakefield-Vette SKV Series skived fin heat sinks

25 June, 2019

The SKV Series skived fin heat sinks, from Wakefield-Vette, are designed to support the latest trends in renewable energy, industrial electrification and transportation.


How to master power density for motor drives

19 July, 2017 by Stefan Hopfe* and Stefan Häuser^

How can motor drive costs be optimised? The answer is by improving the power density through reducing the thermal impedance of the power system.


CUI extruded and stamped aluminium heat sinks

09 June, 2017

CUI's aluminum heat sinks, available in both extruded and stamped versions, are compatible with TO‑218, TO‑220, TO‑252 and TO‑263 transistor packages.


EXAIR small 316 stainless steel cabinet cooler systems

08 May, 2017

The EXAIR small 316 stainless steel cabinet cooler systems with electronic temperature control keep electrical enclosures cool with -7°C air, while maintaining the NEMA 4X rating of the enclosure and resisting the heat that could adversely affect the internal components.


Jumping droplets cool mobile hotspots

06 April, 2017

US researchers have reported a technique designed to address mobile hotspots, which come about through electronic devices' inability to evenly dissipate the waste heat they produce.


Vincotech Müller-Ahlhorn Thermigrease TG 20032 thermal interface material for power modules

21 October, 2015

Responding to rising demand for silicone-free thermal paste, Vincotech has approved Müller-Ahlhorn Thermigrease TG 20032 for the company's power modules. MiniSKiiP modules are the first to ship with this pre-applied silicone-free thermal paste.


Advanced Thermal Solutions zipper fin heat sinks

26 March, 2015

Zipper fin heat sinks from Advanced Thermal Solutions (ATS) protect components from the dangers of excess heat.


element14 heatsink for Raspberry Pi

18 November, 2013

element14 has launched a heatsink for the Raspberry Pi. The product protects the microcomputer from overheating and thus reduces the risk of hardware failure.


Laird Technologies WL series liquid cooling for densely packed electronic environments

19 October, 2012

The self-contained units are designed to remove a large amount of heat from densely packed electronic environments.


Laird Technologies Clarke & Severn Tflex XS400 thermal gap filler

15 November, 2010 by

The Laird Technologies Tflex XS400 series is the latest thermal pad in the thermal gap filler range, offering a compliant elastomer filler specifically designed to provide moderate thermal performance with a conductivity of 2.0 W/mK.


Laird Technologies Tflex SF600 DF thermal gap filler

15 November, 2010 by

The Tflex SF600 DF has been added to Laird Technologies’ Tflex thermal gap filler range. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.


Heat sink front panels

28 July, 2009

Elma Electronic has released a range of front panels that are also heat sinks. The panels dissipate heat while covering open sections of an enclosure.


Machined components

13 March, 2009

Insotec Australia supplies precision machined components produced to exacting quality standards that are used in a wide range of industries, including ticketing, communication, medical, aerospace and industrial equipment.


Heatshrink tubes

01 January, 2009

StockCap has added a range of low-voltage medium-wall heatshrink tubes.


Heat sinks approved

31 July, 2004

Molex has received approval for its CoolFin heat sink from AMD for the next generation 64 bit processor, the Athlon 64.


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