TE Connectivity SmartSeal connector
21 October, 2016 | Supplied by: CommscopeTE Connectivity's rugged SmartSeal connector is designed to withstand the demands of the two-wheeler, ATV/UTV, leisure marine and recreational vehicle markets.
Four strategies to strengthen subassembly sourcing
20 October, 2016 by Ed Sullivan*Selecting subassembly manufacturers with specific capabilities can speed turnaround, improve product performance and functionality, and increase an OEM's bottom line.
HMicro HC1100 wearable wireless biosensor chip
12 October, 2016 | Supplied by: STMicroelectronics Pty LtdHMicro and STMicroelectronics have launched a cooperation to create a single-chip solution for clinical-grade, single-use disposable smart patches and biosensors.
Hammond Electronics 1590 die-cast enclosures
01 September, 2016 | Supplied by: Hammond Electronics Pty LtdThe 1590 die-cast enclosures family from Hammond Electronics consists of 41 different sizes in the standard rectangular and STOMP Box painted variants.
Making a splash in water-resistant digital devices
26 August, 2016The trend in consumer electronics has always been to make them faster, smarter and with ever-expanding capabilities. But waterproofing has become the new focus of global electronics manufacturers and most brands are rushing to include this benefit to ensure they are not left behind in this ultracompetitive market.
ROLEC enclosures IP67/IP69K protection class upgrades
25 August, 2016 | Supplied by: ROLEC OKW Australia New Zealand P/LROLEC now offers its diecast aluminium enclosures with the option of factory-fitted IP protection class upgrades. Depending on the type of enclosure, the ratings can be increased from IP66 to IP67 and from IP67 to IP69K.
Lintek HDI multilayer printed circuit boards
28 July, 2016 | Supplied by: Lintek Pty Ltd
Lintek is offering its clients copper-filled 'via in pad' technology for BGA devices down to 0.35 mm pitch. The company provides blind, buried and castellated vias on multilayer circuit boards manufactured on a wide variety of dielectrics.
Thermaltronics CHT soldering irons
11 July, 2016 | Supplied by: Soanar LimitedThermaltronics' soldering irons, based on Curie Heat Technology (CHT), respond to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. In addition, the soldering hand-piece instantly heats and cools upon removing and replacing from its holder.
ASSCON MultiVacuum vacuum soldering process
08 July, 2016 | Supplied by: Suba EngineeringIn the MultiVacuum process, PCBs are subjected to several vacuum applications during the soldering stages, with the option of applying vacuum both before and during the melting of the solder paste.
congatec conga-IC170 industrial-grade Thin Mini-ITX board
29 June, 2016 | Supplied by: Congatec Australia Pty Ltdcongatec has introduced the Thin Mini-ITX boards with Intel processors with high scalability, ranging from 2 GHz Intel Celeron processors up to 3.4 GHz Intel Core i7 processors.
Hammond 1551USB miniature enclosures
29 June, 2016 | Supplied by: Hammond Electronics Pty LtdTo house small PCBs using USB as the external power and signal interconnect, Hammond Electronics is launching more sizes of its 1551 miniature family. They are 35, 50 or 65 mm long, 20, 25 or 30 mm wide and all 15.5 mm high.
QualiEco Circuits express PCB and assembly services
23 June, 2016 | Supplied by: QualiEco Circuits LtdQualiEco Circuits provides quality electronic manufacturing services and solutions. The company offers express services in all product categories, with customised delivery solutions.
Keysight Technologies M9019A Gen 3 PXIe 18-slot chassis
20 June, 2016 | Supplied by: Keysight Technologies Australia Pty LtdKeysight Technologies has announced a Gen 3 PXIe chassis and set of Gen 3 system components designed for complex, high-performance applications.
Device-to-device communication outside LTE service areas
03 June, 2016 | Supplied by: NEC Australia Pty LtdNEC Corporation has announced device-to-device communication technology that enables emergency response personnel to transmit high-quality images from the scene of a disaster or accident when outside of the service area of the public safety long-term evolution (PS-LTE) network.
LPMS Beta 300 low-pressure moulding machine
01 June, 2016 | Supplied by: Tarapath Pty LtdThe LPMS Beta 300 is a low-pressure moulding machine for small-, medium- or high-volume production. It enables the efficient encapsulation of various electronics including PCBAs, cable connections, connector terminations and other items.
