Assembly

Würth Elektronik PowerBasket SMD plug-in power elements for SMT assembly

08 May, 2019 | Supplied by: Wurth Electronics Australia Pty

Würth Elektronik ICS has released its first plug-in power elements for SMT assembly, the PowerBasket SMD series. Products in the series are lead free and RoHS compliant, and can be processed on conventional SMT lines and soldered using a convection or vapour phase system.


Acromag XMC730 multifunction I/O XMC mezzanine modules

07 May, 2019 | Supplied by: Metromatics Pty Ltd

Acromag has introduced the XMC730 mezzanine modules, which provide flexible, high-density I/O with high-performance DMA to solve a variety of SWaP challenges.


Advantech AIMB-U117 UTX industrial motherboard

01 May, 2019 | Supplied by: Advantech Australia Pty Ltd

The AIMB-U117 UTX industrial motherboard is equipped with Intel Atom E39XX processors and features three independent displays, onboard eMMC storage and good I/O capabilities.


Top 10 considerations when specifying enclosures

22 April, 2019 by Pat Cookson | Supplied by: Hammond Electronics Pty Ltd

Your new industrial electronic product has been designed and the board components specified. Now all that has to be done is to decide on the choice of enclosure for it.


iBASE MB995 ATX motherboard

04 April, 2019 | Supplied by: Backplane Systems Technology Pty Ltd

The MB995, from iBASE, is an ATX motherboard based on the latest 8th Generation Intel Core processor family. With optimised processor and graphics performance, the board supports the C246 (MB995VF-C246) and the Q370 (MB995VF) chipsets.


OKW enclosure modification service

01 April, 2019 | Supplied by: ROLEC OKW Australia New Zealand P/L

OKW Gehäusesysteme has a versatile standard range of design-oriented plastic enclosures and tuning knobs. The requirement for customisation can also be fulfilled by the company's own in-house service centre.


Ultrafast 3D printer for high-performance plastics

18 March, 2019

The 3D printer takes only 18 min to produce a plastic component that is 30 cm high, making it suitable for the additive manufacture of large-volume plastic components.


Cambridge Electronic Industries Rapid ConneXions coaxial connectors

14 March, 2019 | Supplied by: Micromax Pty Ltd

Cambridge Electronic Industries has announced a range of connectors designed for automated pick-and-place manufacturing techniques.


PDR ThermoActive Suite Plus rework software

04 March, 2019 | Supplied by: Mektronics Co Pty Ltd

PDR, a supplier of IR rework technology, has introduced features to its ThermoActive Suite Plus software that will allow the operator to use keyboard functions to execute in-process features such as Thermal Boost, Extended Soak, Skip Zone and Temperature Averaging.


METCASE COMBIMET 24″ extra-deep 19″ rack cases

01 March, 2019 | Supplied by: ROLEC OKW Australia New Zealand P/L

METCASE has launched an extra-deep 24″ version of its COMBIMET 19″ enclosures, suitable for server rack type applications.


Hanwha HM520 Modular Mounter

22 February, 2019 | Supplied by: Machinery Forum Pty Ltd

The Hanwha HM520 Modular Mounter configures a flexible production line by applying a modular head and various production modes.


Kurtz Ersa VERSAFLOW 4XL selective soldering system

21 February, 2019 | Supplied by: Machinery Forum Pty Ltd

The VERSAFLOW 4XL selective soldering system, from Kurtz Ersa, provides good flexibility and application variety with a high level of soldering quality.


EXAIR Soft Grip Back Blow Safety Air Gun

19 February, 2019 | Supplied by: Compressed Air Australia Pty Ltd

EXAIR's Soft Grip Back Blow Safety Air Gun uses a small back blow nozzle to deliver a blast of air to effectively blow debris and liquids from inside small pipe or hose diameters, channels, bores, holes, internal threads and other internal part features.


Phoenix Contact ICS series modular electronics housings

19 February, 2019 | Supplied by: Phoenix Contact Pty Ltd

The ICS (Industrial Case System) electronics housings from Phoenix Contact are available in graduated sizes, and with standardised device connections such as RJ45, USB, D-SUB and antenna sockets.


DuPont Electronics & Imaging In-Mold Electronic materials

13 February, 2019 | Supplied by: DuPont Australia Pty Ltd

DuPont Electronics & Imaging has launched its second generation of In-Mold Electronic (IME) materials with key advancements in its electrically conductive adhesive, protection encapsulant and crossover dielectric.


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