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Electronic components often generate significant amounts of heat while in use. Failure to effectively dissipate this heat away from the device can lead to reliability concerns and reduce operational lifetimes.
Failing verification or qualification of wireless technologies within a new product design increases developmental costs and delays the product release. Similarly, an EMI compliance test is expensive and also puts the product schedule at risk.
Selecting the right power architecture for your system is critical to significantly reduce its size and weight. Factorised Power Architecture (FPA) is an interesting approach that can result in power systems that are 8 to 10 times lighter and smaller than conventional solutions.
Specialised chemical products for LED application now enhance device quality and performance. LED systems can be protected from a variety of damaging conditions, such as corrosive environments, and show significant increases in efficiency and reductions in energy consumption.
IoT device battery life can range from a couple of days to 30 years. To reduce energy consumption and optimise battery life you need to accurately determine the power consumption of each device component, as well as overall operation on a system level.
This series of expert guidelines examines all facets of wireless communication and demonstrates the steps necessary to protect and strengthen your LMR system.
A new line of AC-DC front-end components allows the Power Component Design Methodology to be used from AC to the point of load. This now enables engineers to construct efficient and adaptable power systems with a building blocks approach.
A common challenge in the creation of an electronic power system is developing a power chain that takes up less space, allowing more room for other parts of the system. Engineers can use a combination of several techniques to achieve this outcome.
Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.
Operators in many markets are transitioning to 3G and 4G technologies, whilst other operators have preferred to invest in maintaining and upgrading 2G networks for the foreseeable future. Understanding the strengths and weaknesses of each technology is paramount, amongst considerations of hardware and software to suit, in planning to scale from 2G to 3G to 4G LTE.
With the growth in use of renewable sources of power, the energy storage systems (ESS) market, particularly battery systems, is set to soar. ESS designers are selecting batteries to replace traditional mechanical means of energy storage such as hydro pumps.
The vertical resolution of an oscilloscope determines how accurately signals are displayed. Industries including consumer goods, medicines and R&D are increasingly demanding high vertical definition devices.
Flex and rigid-flex PCBs have a wide range of applications - from military weaponry and aerospace systems to mobile phones and digital cameras. Their use in medical equipment is constantly increasing due to their improved reliability.
Large-sized LCD displays have limitations – poor aspect ratio, high power consumption and low resolution. A technological breakthrough has enabled high quality visual resizing opening up new display opportunities.