Assembly > Soldering tools

Würth Elektronik WE-SMGS solderable seal

28 October, 2019

Würth Elektronik's WE-SMGS is a solderable seal for surface mounting. The product consists of a temperature-resistant foam material, which combines the conductive seal with high elasticity.

Neoden IN6 reflow oven

13 September, 2019

The Neoden IN6 reflow oven was carefully designed with proper heating elements and next-generation sensors that ensure consistent and even heating throughout the entire length of the process chamber.

EXAIR 1/8 NPT small internal mix spray nozzles

22 May, 2019

EXAIR's 1/8 NPT small internal mix spray nozzles atomise fluids up to 106 L/h. The nozzles mix the liquid and air inside the cap and produce fine atomisation. They can be used on liquids with a viscosity up to 300 cP.

Rehm VXC series convection reflow systems

13 July, 2017

Rehm's VXC series convection reflow systems offer optimised heat transfer and thermal stability, with low real-world cross-profile performance, low MTBF and low power usage.

Rehm Thermal Systems Condenso XC Batch Vacuum Reflow System

11 July, 2017

The Condenso XC Batch Vacuum Reflow System is suitable for high-technology, large thermal mass, difficult soldering applications.

RS Components Raspberry Pi prototyping board

16 February, 2017

The RS Components Raspberry Pi prototyping board is suitable for electronics engineers, as well as being well suitable for education and the training of students and electronics beginners.

Thermaltronics TMT-HA Series hot air tools

08 October, 2015

The TMT-HA200 hot air tool can be used for surface-mount component removal and reflow on packages such as SOIC, QFP, PLCC and other chip components. The TMT-HA300 hot air tool uses a large diaphragm pump and features a digital temperature readout as well as a visual air flowmeter.

Thermaltronics TZ-KIT-1 tweezer kit

18 August, 2014

Soldering equipment manufacturer Thermaltronics has released a tweezer kit as an add-on accessory to its Flagship soldering station TMT-9000S-2. The TZ-KIT-1 encompasses an ergonomically designed tweezer handpiece that is suitable for reworking even the smallest components.

Hakko FX100 soldering system

08 August, 2014

The FX100 soldering system brings induction heat soldering technology to a high performance level. A small, compact station includes microprocessor control that boosts the recovery performance of the soldering iron tip.

DEK VectorGuard Framing System

05 August, 2014

The DEK VectorGuard Framing System is an automatic tensioning system for solder paste stencils. It eliminates the need for complex alignment procedures and is independent of traditional pneumatic assistance processes.

Weller BP865CEU dual battery-powered soldering iron

08 July, 2014

The Weller BP865CEU dual battery-powered soldering iron delivers either 6 W of power on low setting level I (380°C) or 8 W on high setting level II (480°C), giving the user the versatility to solder everything from microelectronics to small appliances.

Vishay 850 nm IR emitter

03 February, 2014

Vishay has broadened its optoelectronics portfolio with the release of an 850 nm infrared (IR) emitter in a compact 3.85 x 3.85 x 2.24 mm top-view SMD package.

Penn Engineering microPEM inserts

30 January, 2014

The Penn Engineering microPEM thru-threaded brass inserts for plastics introduce suitable fastener solutions to attach components in compact electronic assemblies.

Weller W60D temperature-controlled soldering tool

23 November, 2013

The Weller W60D 60 W, 240 V soldering iron with magnastat temperature control is for precise work on the workbench. The magnastat system operates through a ferromagnetic sensing device which changes its characteristics when specific temperatures are reached.

Weller WPA2 butane-powered soldering tool

22 November, 2013

The WPA2 butane-powered soldering tool is for portable applications where 240 V power is either not available or convenient. The push-button piezo ignition uses its own energy to create a spark and light the torch.

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