Assembly

Microchip PIC24F curiosity development board

24 March, 2017 | Supplied by: Mouser Electronics (Hong Kong) Ltd

The Microchip PIC24F curiosity development board is a fully integrated 16-bit development platform for first-time users, designers and those requiring a feature-rich rapid prototyping board.


RS Components RS Pro range painted die-cast aluminium enclosures

22 March, 2017 | Supplied by: RS

The RS Components RS Pro range of painted die-cast aluminium enclosures is designed for use where there is a potentially explosive atmosphere.


congatec conga-IC175 Thin Mini-ITX thin industrial-grade motherboard

21 March, 2017 | Supplied by: Congatec Australia Pty Ltd

The congatec conga-IC175 Thin Mini-ITX thin industrial-grade motherboard features the 7th Gen Intel Core U (Kaby Lake) processors designed for IoT connected devices.


OKW Gehäusesysteme STYLE-CASE handheld enclosure

01 March, 2017 | Supplied by: ROLEC OKW Australia New Zealand P/L

The STYLE-CASE handheld enclosure is suitable for remote control units and controllers, as well as for mobile data recording in medical technology, the home and industry.


Keysight Technologies PXIe chassis

27 February, 2017 | Supplied by: Keysight Technologies Australia Pty Ltd

The Keysight Technologies PXIe chassis range enables a broad range of applications in R&D and manufacturing.


RS Components Raspberry Pi prototyping board

16 February, 2017 | Supplied by: RS

The RS Components Raspberry Pi prototyping board is suitable for electronics engineers, as well as being well suitable for education and the training of students and electronics beginners.


Low-temperature soldering reduces emissions

15 February, 2017 | Supplied by: Lenovo

Technology company Lenovo has announced a new low-temperature solder (LTS) process, developed to improve PC manufacturing by conserving energy and increasing reliability.


Advantech AIMB-216 Thin Mini-ITX Motherboard

01 February, 2017 | Supplied by: Advantech Australia Pty Ltd

Advantech has announced the AIMB-216, an industrial-grade fanless Thin Mini-ITX motherboard. With Intel Pentium/Celeron N3710/N3160/N3010 processor support, plus the latest Intel 14 nm technology, it offers significant CPU and graphics performance improvements with low power consumption.


EXAIR Ion Air Cannon

19 January, 2017 | Supplied by: Compressed Air Australia Pty Ltd

EXAIR's Ion Air Cannon eliminates static electricity and cleans at distances up to 4.6 m, with no moving parts. It is suitable for benchtops, machine mounting and those hard-to-reach spaces that require a concentrated flow of static-eliminating ions.


3D-printed drone features embedded electronics

06 December, 2016

Singaporean researchers have 3D-printed a ready-to-fly drone with embedded electronics using aerospace-grade material.


Axiomtek IMB500 industrial ATX motherboard

24 November, 2016 | Supplied by: Braemac Pty Ltd

The Axiomtek IMB500 industrial ATX motherboard is powered by 6th generation Intel Core, Pentium and Celeron processors in the LGA1151 socket with Intel Q170 chipset.


Screen Process Circuits die cut and laser cut gaskets

07 November, 2016 | Supplied by: Screen Process Circuits

Screen Process Circuits die cut and laser cut gaskets can be manufactured in many shapes, sizes and thicknesses and from a variety of different materials to meet sealing requirements.


OKW enclosure customisation service

04 November, 2016 | Supplied by: ROLEC OKW Australia New Zealand P/L

OKW Gehäusesysteme has a versatile range of design-oriented plastic enclosures and tuning knobs. However, the requirement for customisation can also be fulfilled by the company's in-house service centre.


TE Connectivity SmartSeal connector

21 October, 2016 | Supplied by: Commscope

TE Connectivity's rugged SmartSeal connector is designed to withstand the demands of the two-wheeler, ATV/UTV, leisure marine and recreational vehicle markets.


Four strategies to strengthen subassembly sourcing

20 October, 2016 by Ed Sullivan*

Selecting subassembly manufacturers with specific capabilities can speed turnaround, improve product performance and functionality, and increase an OEM's bottom line.


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