Protecting POS terminals from attack
25 July, 2017Three-dimensional moulded interconnect devices (3D-MIDs) are increasingly being used by manufacturers of POS terminals to improve security standards and fend off hacker attacks.
How to master power density for motor drives
19 July, 2017 by Stefan Hopfe* and Stefan Häuser^ | Supplied by: Semikron DanfossHow can motor drive costs be optimised? The answer is by improving the power density through reducing the thermal impedance of the power system.
Rehm VXC series convection reflow systems
13 July, 2017 | Supplied by: Onboard SolutionsRehm's VXC series convection reflow systems offer optimised heat transfer and thermal stability, with low real-world cross-profile performance, low MTBF and low power usage.
Extra Eye First Article Inspection process
12 July, 2017 | Supplied by: Onboard SolutionsExtra Eye's automated First Article Inspection process is said to be much faster than manual inspection. With set-up in minutes and easy operation, the process provides an alternative to automatic optical inspection (AOI) for low-volume series.
Rehm Thermal Systems Condenso XC Batch Vacuum Reflow System
11 July, 2017 | Supplied by: Onboard SolutionsThe Condenso XC Batch Vacuum Reflow System is suitable for high-technology, large thermal mass, difficult soldering applications.
Innovative enclosures for Industry 4.0
10 July, 2017 | Supplied by: ROLEC OKW Australia New Zealand P/LThe development to Industry 4.0 affects the design and performance of enclosures for the installation of control units. As an enclosure specialist, ROLEC has incorporated these requirements into its current range.
Hi-Q Components nylon 6/6 components for plastic circuit boards
10 July, 2017 | Supplied by: Hi-Q Electronics LtdHi-Q Components stocks a large range of nylon 6/6 components commonly used in circuit board manufacturing. Nylon 6/6 is suitable for circuit board applications due to its chemical resistance, electrical insulation and high tensile strength.
Sun Industries Hybrid decals
07 July, 2017 | Supplied by: Sun Industries Pty LtdBy incorporating digital processes into its graphics manufacturing, Sun Industries is able to offer full customisation of users' decals with durability characteristics.
Tarapath Beta 300 2T benchtop moulding machine
06 July, 2017 | Supplied by: Tarapath Pty LtdThe Beta 300 2T benchtop moulding machine processes the Technomelt range of materials to encapsulate and overmould various electronics, protecting them from environmental factors such as moisture, dust and vibration.
DuPont and TactoTek collaborate on in-mould electronics
06 July, 2017 | Supplied by: DuPont Australia Pty LtdDuPont Electronics and Communications is collaborating with TactoTek, a designer and producer of injection-moulded electronics (IME), to meet the growing demand for IME solutions.
element14 Pi Desktop Raspberry Pi accessories
05 July, 2017 | Supplied by: element14Pi Desktop is a set of Pi accessories which can convert Raspberry Pi 1/2/3 to a real computer.
3D printing using ultrasonic waves
04 July, 2017Software company Neurotechnology is developing ultrasonic technology that will enable the 3D printing and assembly of almost any type of object using a wide range of different materials and components.
OKW adds applications webpages for enclosures
03 July, 2017 | Supplied by: ROLEC OKW Australia New Zealand P/LOKW has added a new Applications section to its website to help design engineers specify the best enclosures for their electronics.
Improved cleaning performance for silicon wafer assemblers
03 July, 2017 | Supplied by: ElectrolubeElectrolube has developed an innovative cleaning solution called Safewash Super (SWAS) for PCB wafer assemblers, following close collaboration with a number of manufacturers to improve their cleaning capabilities as well as speed up throughput, reduce costs and decrease environmental impact.
Markforged Mark Two and Mark X 3D printers
03 July, 2017 | Supplied by: Emona Instruments Pty LtdThe Markforged range of 3D printers will print high-strength carbon fibre parts with the strength of metal for end-use products, prototypes, enclosures, brackets and mounts.
