The quantum communication chip is said to be 1000 times smaller than current quantum set-ups, while offering the same high security that quantum technology is known for.
A plug-and-play powerline communication (PLC) development toolset from STMicroelectronics is designed to accelerate the development of turnkey powerline networks by providing all the hardware and software components needed to build and run a PLC application.
The G.hn Wave-2 networking chipset, from MaxLinear, features the G.hn digital baseband and G.hn analog front ends. The networking platform offers designers the flexibility to combine footprint-compatible components to address multiple G.hn applications.
The STMicroelectronics ST8500 powerline-communication (PLC) solution features a G3-PLC CENELEC B certified protocol stack for industrial applications beyond utility metering, such as in smart cities, street lighting, renewable energy management, and railway smart tunnels and stations.
STMicroelectronics is powering the shift to smarter energy consumption and management with its modular Power-Line Communication (PLC) modem chipset, set to provide flexibility to manufacturers of utility meters, smart-grid nodes, streetlamps, and home and industrial controllers.
STMicroelectronics has integrated its contactless near-field communication (NFC) technology with mobile platforms from MediaTek, said to be the world's second-largest supplier of mobile handset solutions.
A miniaturised wireless battery-charging chipset from STMicroelectronics saves space, simplifies enclosure design and sealing, and accelerates time to market for ultracompact sports wearables, wellness monitors, medical sensors and remote controllers.
Interface Concept IC-PPC-VMeb and IC-PPC-VPX3d digital signal processing boards and single-boards computers25 September, 2016
The Interface Concept IC-PPC-VMeb and IC-PPC-VPX3d digital signal processing boards and single-boards computers are suitable for applications requiring high-bandwidth data processing computations.
The Acromag ACEX-4600 COM Express carrier is a rugged COM Express modular platform, designed with rigid PCBs and extended temperature support for extreme industrial and defence applications.
Researchers have designed multipurpose programmable optical chips that could revolutionise the microwave photonics industry.
STMicroelectronics has shipped its 100 millionth chipset for digital cable and satellite set-top boxes (STBs) in India.
Samsung Electronics has begun mass production of advanced logic chips using its 14 nm Low-Power Plus (LPP) process, the second generation of the company's 14 nm FinFET process technology.
A new process to grow designer crystals, known as 'metal organic frameworks' or MOFs, could lead to a new breed of faster, more powerful electronic devices.
Dialog Semiconductor has released its iW630+iW1780+iW671 Rapid Charge adapter chipset. The chipset provides the high efficiency and power density needed for small-form-factor, fast-charging smartphones and mobile device power adapters.
Computer chips' clocks have stopped getting faster. To keep delivering performance improvements, chipmakers are instead giving chips more processing units, or cores, which can execute computations in parallel.