Another step towards GaN power devices

27 June, 2008

IMEC and AIXTRON have demonstrated the growth of AlGaN/GaN heterostructures on 200 mm silicon wafers. This demonstration is another step towards fabricating low-cost GaN power devices for high-efficiency/high-power systems beyond the silicon limits.

Alternative to silicon chip

04 June, 2008

A transistor that uses gallium nitride (GaN) instead of silicon has been invented. It can reduce power consumption and improve the efficiency of power electronics systems in everything from motor drives and hybrid vehicles to house appliances and defence equipment.

Models make transistors more efficient

04 June, 2008

New models of how two types of power transistors perform that will result in more efficient smart electrical circuits, making technologies such as cars and home appliances more reliable and environmentally friendly, have been developed by European researchers.

Chassis for embedded boards

01 June, 2008 | Supplied by: ICP Electronics Australia Pty Ltd

ICP Electronics has launched the EBC-2100 series of micro chassis for EPIC embedded boards. The chassis support industrial embedded EPIC boards from ULV Celeron 400 MHz, AMD GX 466 MHz and LX800 500 MHz up to Pentium M versions.

Vectek electronic switch

01 June, 2008 | Supplied by: Vectek Electronics Ltd

An electronic switch has been released by New Zealand company Vectek Electronics. To achieve high reliability it is often necessary to switch to an alternative power supply quickly but without connecting the two supplies together and transferring any fault that may be present.

Embedded fanless Pcs

01 June, 2008 | Supplied by: ICP Electronics Australia Pty Ltd

ICP Electronics has launched its Afolux series of fanless panel PCs that are available with 7, 8.4, 12.1, 15, 17 and 19" sized LCD displays.

Power modules extended

01 June, 2008 | Supplied by: ERNTEC Pty Ltd

Erni Electronics has upgraded its hard metric universal power module to include new 5-, 6- and 7-pin versions. The UPMs augment the existing 3-pin power modules and match their current carrying capacity of 18A per contact (at 20ºC).

LCDs made from graphene

13 May, 2008

Researchers at the University of Manchester in England have produced tiny liquid crystal devices with electrodes made from graphene — a development that could lead to computer and TV displays based on this technology.

Joint venture to develop OLED displays

13 May, 2008

DuPont and Dainippon Screen Manufacturing have formed an alliance to develop integrated manufacturing equipment for printed organic light emitting diode (OLED) displays.

Transistor Holy Grail nearer

13 May, 2008

Better switching performance of transistors of disordered silicon films can be achieved by making the conduction channel in the device very thin, according to research at the University of Surrey in England.

Ultra low leakage diode

08 May, 2008 | Supplied by:

Central Semiconductor has released the CMAD6001 ultra low leakage diode in the SOD-923 package. This device is a 100 V, 250 mA diode with a low leakage current (IR) of 0.5 nA max., and low capacitance of 2.0 pF max.

CAN bus interface

08 May, 2008 | Supplied by:

Impart Special Products,  Australian supplier of Emergency Vehicle Control & Safety Systems, has announced iCAN, which is a programmable set of modules that interface into a vehicle's CAN Bus system to retrieve information for use by the vehicle’s body control system.

Graphene used to create tiny transistor

06 May, 2008

Graphene has been used to create the world’s smallest transistor, one atom thick and 10 atoms wide, according to Dr Kostya Novoselov and Prof Andre Geim from The School of Physics and Astronomy at The University of Manchester.

Photonic crystal stamp

01 May, 2008

A high-accuracy, low-cost photonic stamp in silicon is aimed at helping the growing demand for photonic crystal structures necessary for future photonic devices.

Expanded line card

23 April, 2008

Richardson Electronics has released the 2008 line card for its RF, wireless and power conversion division, which designs and distributes components, modules and assemblies used in RF and wireless infrastructure, networks, digital broadcasting, defence and power conversion.

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