Components

Light blurs data transfer

15 September, 2008

Combining ordinary electronics with light has been a potential way to create minimal computer circuits with super fast information transfer. Researchers at Umeå University in Sweden and the University of Maryland in the US are now showing that there is a limit.


Graphene discovery wins major award

08 September, 2008

Two physicists from The University of Manchester who discovered the world’s thinnest material have scooped a major award for their work.


RF and microwave laminate

07 September, 2008 | Supplied by: http://www.clarke.com.au

Taconic’s TLX range of laminates can be sheared, drilled, milled and plated using standard manufacturing methods for PTFE/woven fibreglass materials. The laminates are dimensionally stable and exhibit virtually no moisture absorption during fabrication.


Silicon back in the race for quantum computers

02 September, 2008

The odds that the quantum computer will be built of silicon have increased now that researchers from the Centre for Quantum Computer Technology (CQCT) have announced recently invented technology.


White LEDs go brighter

02 September, 2008

Osram development engineers are claiming new records for the brightness and efficiency of white LEDs in the laboratory.


Chip scales under scrutiny

02 September, 2008

Smaller and faster are two goals in today’s electronics market, and an article in an international trade publication shows how North Dakota State University researchers, Fargo, design and build such electronics packages.


Compact cooling results in faster and more sensitive electronics

28 August, 2008

Researcher Srinivas Vanapalli has investigated the possibilities for the extreme cooling of electronic components at a chip level.


Standalone embedded control PCs

10 August, 2008 | Supplied by: Interworld Electronics and Computer Industries

The Boxer Series of products are high-performance standalone embedded PCs featuring: fanless operation, compact size, robust construction, low power requirements, high vibration/shock protection, wide operating temperature range and certified embedded OS support.


HSPA module

10 August, 2008 | Supplied by: http://www.m2mconnectivity.com.au

M2M Connectivity has launched the Sierra Wireless MC8790 module for 3G/HSPA networks. It is designed for developers integrating mobile broadband capabilities into modems, terminals, routers and other products requiring high-speed data over 3G/HSPA networks.


Couplers enable silicon photonics

07 August, 2008

Silicon photonics can now be more efficiently connected to mainstay low index contrast fibre following a development by Chiral Photonics scientists.


Afolux fanless panel PCs

01 August, 2008

The Afolux LX800 all-in-one panel PCs are powered by an AMD LX800 CPU and support up to 1 GB of RAM. A CompactFlash card is used for data storage.


Another company joins 3D research

01 August, 2008

IMEC, Europe's nanoelectronics research institute, and Qualcomm, will collaborate to understand and devleop solutions for using 3D technologies in future wireless products.


Web applications

01 August, 2008 | Supplied by: Citrix Systems Pte Ltd

Citrix Systems has announced its NetScaler MPX range of web application delivery systems.


Multimedia processor

01 August, 2008 | Supplied by: Avnet Electronics Marketing

Freescale Semiconductor has introduced the i.MX37 multimedia applications processor, a device for a portable media player, mobile internet and portable GPS navigation.


NEC LCD module

01 August, 2008 | Supplied by: Soanar Limited

NEC LCD Technologies has introduced a 22.5" TFT LCD module with wide ultra-extended graphics array (WUXGA) resolution.


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