Harwin M80 Mix-Tek miniature connector system
05 May, 2011 | Clarke & Severn Electronic Solutions
Harwin’s M80 Mix-Tek miniature connector system with high-performance contacts reduces space and weight in board-to-board, board-to-cable and cable-to-board applications. The system mixes high power and signal contacts in the same secure polarised connection.
Clarke & Severn STC5420 timing chip
05 April, 2011 | Clarke & Severn Electronic Solutions
The RoHS 6/6 compliant STC5420 series is a single-chip clock synchronisation solution for applications in SDH/SETS, SONET and synchronous ethernet network elements. The devices are fully compliant with ITU-T G.813 option one and two and Telcordia GR1244 and GR253.
Taconic RF-301 microwave laminate
05 April, 2011 | Clarke & Severn Electronic Solutions
The RF-301 from Taconic is a development of the company’s RF-30 generation. Highest PIM (passive intermodulation) performance, coupled with a good price/performance ratio, is claimed to make it the new standard for DK 3.0 substrates.
Omnetics Micro-D connector
05 April, 2011 | Clarke & Severn Electronic Solutions
Omnetics Micro-D connectors for high-reliability aerospace, military, medical, optics, guidance systems, space and unmanned aerial vehicle (UAV) applications are available from nine to 51 contacts with termination types ranging from wire-to-wire, surface mount, solder cup, and thru-hole.
Mini Circuits PWR-2.5GHS-75 smart power sensor
30 March, 2011 | Clarke & Severn Electronic Solutions
The Mini Circuits PWR-2.5GHS-75 smart power sensor is a 75 Ω, pocket-sized, precision test USB HID device (no driver installation required) that turns a Windows or Linux PC into a power meter.
Harwin circular connector family
24 March, 2011 | Clarke & Severn Electronic Solutions
Harwin, the hi-rel connector and SMT board hardware manufacturer, says that users of its C90 industrial range of circular connectors have available 360° EMC screening via a new series of screening braid adapters.
ODU ODU-MAC modular connector system
24 March, 2011 | Clarke & Severn Electronic Solutions
The ODU-MAC modular connector system from ODU is equipped with a range of combination possibilities and with particular modules such as customisable frames, plastic insulation bodies and removable crimp contacts for power, signal, coax, air couplings and fibre-optic connections.
Harwin EZ-coin cells
14 March, 2011 | Clarke & Severn Electronic Solutions
Harwin EZ-coin cells feature single-piece, low-profile SMT coin cell retainer; 12.5 mm diameter x 2.5 mm thick BR1225 and CR1225 coin cell batteries; phosphor bronze - tin plated; flow-hole solder pad design to improve reflow and strengthen solder joints; dual spring contacts retain cells to the PCB; polarity is clearly marked to prevent incorrect insertion of battery; balanced and lightweight for pick and place processes.
Clarke & Severn Electronics GaN HEMT transsistors
14 March, 2011 | Clarke & Severn Electronic Solutions
Cree has released GaN HEMT transistors for frequency-agile, software defined radios, 3G/4G telecom BTS, C-OFDM data-links and satcom applications.
Cree RF GaN HEMT transistors
14 March, 2011 | Clarke & Severn Electronic Solutions
Cree RF has released GaN HEMT transistors for frequency-agile, software defined radios, 3G/4G telecom BTS, C-OFDM data-links and satcom applications.
Conxall Mil-E-Qual earth pin connector
21 February, 2011 | Clarke & Severn Electronic Solutions
The first mate last break connector is suitable for many applications as many alternative energy applications and others need to ensure they are grounded when they first plug in the connector.
Cree RF power amplifiers and switches
30 November, 2010 | Clarke & Severn Electronic Solutions
The CMSA30025S from Cree RF is claimed to be the first GaN MMIC SPDT switch to operate over the 300 MHz to 3 GHz range with less than 0.7 dB insertion loss, 30 dB isolation and less than 20 nec switching speed.
Cree RF GaN HEMT MMIC amplifier range
26 November, 2010 | Clarke & Severn Electronic Solutions
Cree RF has developed five GaN HEMT MMIC amplifiers that increase the range of frequencies available to X-band.
Laird Technologies Clarke & Severn Tflex XS400 thermal gap filler
15 November, 2010 | Clarke & Severn Electronic Solutions
The Laird Technologies Tflex XS400 series is the latest thermal pad in the thermal gap filler range, offering a compliant elastomer filler specifically designed to provide moderate thermal performance with a conductivity of 2.0 W/mK.
Laird Technologies Tflex SF600 DF thermal gap filler
15 November, 2010 | Clarke & Severn Electronic Solutions
The Tflex SF600 DF has been added to Laird Technologies’ Tflex thermal gap filler range. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.
