Modules :: Components :: ElectronicsOnline

Components > Modules

Power modules

28 July, 2009

Vishay has unveiled its Gen VII series of general-purpose, high-voltage power modules that feature increased current handling, lighter weight, lower thermal resistance, improved reliability and lead-free construction.

Line digital I/O modules

28 July, 2009

Interworld Electronics has released two USB-104 form factor digital I/O modules from Acces I/O.

Ethernet modules

17 June, 2009 by

Interworld has released Quatech’s Airborne enterprise class wireless ethernet modules.

Wireless module

17 June, 2009 by

LPRS has introduced the MU-2-R, an embedded low-power radio modem, for transmitting serial data at 434 MHz.

Networking module

17 June, 2009 by

Lantronix has enhanced its MatchPort b/g Pro embedded wireless networking module by including ethernet-to-wireless bridging and SmartRoam technology.

Broadband modules

17 June, 2009 by

RF Micro Devices has added two broadband units to its range of transmission products.

Front-end modules

17 June, 2009 by

Microsemi has released the LX5551 and LX5552 front-end modules for IEEE 802.11b/g/n applications in the 2.4–2.5 GHz frequency range.

SKiiP4 power module

17 June, 2009

SKiiP4, the latest generation of intelligent IGBT power modules, has a longer service life than non-sintered modules and can be used in higher temperatures.

Wireless CPU

10 June, 2009

The Wavecom Q26 Extreme 3G/HSPA module offers tri-band HSPA with quad-band GSM/GPRS/EDGE as well as a programmable Wireless CPU.

Modular supply

01 June, 2009 by

Powerbox has introduced three high-power DC modules for the ReFlex Power programmable, modular power system.

LAN dual-band modules

01 June, 2009 by

M2M Connectivity has released wireless LAN dual-band modules.

Bluetooth profile

01 June, 2009 by

Bluegiga’s OEM Bluetooth modules are now available with Bluetooth health device profile.

Infrared emitter

01 June, 2009 by

Vishay has broadened its optoelectronics portfolio with the VSLB3940 940 nm infrared emitter that features an on-axis radiant intensity of 65 mW/sr and optical power of 40 mW at 100 mA. This is claimed to represent about an 8% performance improvement over the larger, 5 mm TSAL6200 in a 40% smaller form factor.

Data acquisition drivers

01 June, 2009 by

Interworld Electronics has available the Acces I/O range of USB data acquisition modules with LabVIEW VI and Linux drivers.

Modular power solution

01 June, 2009 by

Powerbox has released Vicor’s VI Brick PRM (pre-regulator module) and VTM (voltage transformation module) current multiplier, members of the VI Brick family that provides a modular platform for power solutions.