Linear Technology battery chargers
15 September, 2009Linear Technology has introduced the LT3650-4.1 and LT3650-4.2 compact, monolithic, high-voltage battery chargers for single-cell Li-Ion polymer batteries.
Data module
17 August, 2009 byTelit has released the UC864-WD, a 3G wireless data module designed to be fully compatible with the company’s GSM/GPRS and CDMA products in the compact, unified form factor family.
Receiver module
17 August, 2009 byFastrax has introduced its UC324 OEM GPS receiver module that uses the SiRF single chip receiver GSC3LT having navigation sensitivity of -159 dBm.
Thermocouple module
28 July, 2009National Instruments has announced the NI 9213 thermocouple module that adds high-density measurements to the C series platform.
Power modules
28 July, 2009Vishay has unveiled its Gen VII series of general-purpose, high-voltage power modules that feature increased current handling, lighter weight, lower thermal resistance, improved reliability and lead-free construction.
Line digital I/O modules
28 July, 2009Interworld Electronics has released two USB-104 form factor digital I/O modules from Acces I/O.
Ethernet modules
17 June, 2009 byInterworld has released Quatech’s Airborne enterprise class wireless ethernet modules.
Wireless module
17 June, 2009 byLPRS has introduced the MU-2-R, an embedded low-power radio modem, for transmitting serial data at 434 MHz.
Broadband modules
17 June, 2009 byRF Micro Devices has added two broadband units to its range of transmission products.
Front-end modules
17 June, 2009 byMicrosemi has released the LX5551 and LX5552 front-end modules for IEEE 802.11b/g/n applications in the 2.4–2.5 GHz frequency range.
Networking module
17 June, 2009 byLantronix has enhanced its MatchPort b/g Pro embedded wireless networking module by including ethernet-to-wireless bridging and SmartRoam technology.
SKiiP4 power module
17 June, 2009SKiiP4, the latest generation of intelligent IGBT power modules, has a longer service life than non-sintered modules and can be used in higher temperatures.
Wireless CPU
10 June, 2009The Wavecom Q26 Extreme 3G/HSPA module offers tri-band HSPA with quad-band GSM/GPRS/EDGE as well as a programmable Wireless CPU.
Modular power solution
01 June, 2009 byPowerbox has released Vicor’s VI Brick PRM (pre-regulator module) and VTM (voltage transformation module) current multiplier, members of the VI Brick family that provides a modular platform for power solutions.
Infrared emitter
01 June, 2009 byVishay has broadened its optoelectronics portfolio with the VSLB3940 940 nm infrared emitter that features an on-axis radiant intensity of 65 mW/sr and optical power of 40 mW at 100 mA. This is claimed to represent about an 8% performance improvement over the larger, 5 mm TSAL6200 in a 40% smaller form factor.
