Interface module
17 September, 2009 byCongetec has available the conga-QA, a compact module using the Atom processor.
Drive module
16 September, 2009 byACS Motion Control has enhanced the drive operation of its MC4U integrated modular control system with the development of a 4-axis high-voltage universal digital drive module.
16-bit quad DAC
15 September, 2009 byLinear Technology has introduced the LTC2754-16, a quad 16-bit current output digital-to-analog converter that achieves ±1 LSB integral nonlinearity and differential nonlinearity.
Linear Technology battery chargers
15 September, 2009Linear Technology has introduced the LT3650-4.1 and LT3650-4.2 compact, monolithic, high-voltage battery chargers for single-cell Li-Ion polymer batteries.
Receiver module
17 August, 2009 byFastrax has introduced its UC324 OEM GPS receiver module that uses the SiRF single chip receiver GSC3LT having navigation sensitivity of -159 dBm.
Data module
17 August, 2009 byTelit has released the UC864-WD, a 3G wireless data module designed to be fully compatible with the company’s GSM/GPRS and CDMA products in the compact, unified form factor family.
Thermocouple module
28 July, 2009National Instruments has announced the NI 9213 thermocouple module that adds high-density measurements to the C series platform.
Line digital I/O modules
28 July, 2009Interworld Electronics has released two USB-104 form factor digital I/O modules from Acces I/O.
Power modules
28 July, 2009Vishay has unveiled its Gen VII series of general-purpose, high-voltage power modules that feature increased current handling, lighter weight, lower thermal resistance, improved reliability and lead-free construction.
Wireless module
17 June, 2009 byLPRS has introduced the MU-2-R, an embedded low-power radio modem, for transmitting serial data at 434 MHz.
Front-end modules
17 June, 2009 byMicrosemi has released the LX5551 and LX5552 front-end modules for IEEE 802.11b/g/n applications in the 2.4–2.5 GHz frequency range.
Broadband modules
17 June, 2009 byRF Micro Devices has added two broadband units to its range of transmission products.
Networking module
17 June, 2009 byLantronix has enhanced its MatchPort b/g Pro embedded wireless networking module by including ethernet-to-wireless bridging and SmartRoam technology.
Ethernet modules
17 June, 2009 byInterworld has released Quatech’s Airborne enterprise class wireless ethernet modules.
SKiiP4 power module
17 June, 2009SKiiP4, the latest generation of intelligent IGBT power modules, has a longer service life than non-sintered modules and can be used in higher temperatures.
